FR4環氧板的加工方法

FR4有其他的名稱：包括FR-4光學板、FR-4纖維板、FR-4環氧樹脂板和FR-4阻燃絕緣板。這些標題也從側面反映了FR-4玻璃纖維板的廣泛應用。FR-4玻璃纖維板通常用于軟包裝基層，然后將布和皮革包裹在外面，使墻壁和天花板裝飾美觀。它被廣泛使用。它具有吸聲、隔音、隔熱、環保、阻燃等特點。以下是FR-4玻璃纖維板的具體性能特點分析：FR-4環氧玻璃纖維布是以環氧樹脂為粘合劑，電子玻璃纖維布為增強材料的基材。其粘合片和內芯薄覆銅板是制造多層印制電路板的重要基材。

There are many other names, including FR-4 light sheet, FR-4 fiber sheet, FR-4 epoxy sheet, FR-4 flame retardant sheet, so many names also reflect the wide application of FR-4 fiberglass sheet from other side. . FR-4 fiberglass sheet is generally used for soft-packing base layer, and then wrapped with fabric, leather, etc., to make beautiful wall and ceiling decoration. The application is very extensive. With sound absorption, sound insulation, heat insulation, environmental protection, flame retardant and so on. The following is a detailed analysis of the performance characteristics of FR-4 glass fiberglass sheet: FR-4 epoxy fiberglass cloth, which is a kind of substrate with epoxy resin as binder and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper clad plate are important substrates for making multilayer printed circuit boards.

性能：環氧玻璃纖維布基材的力學性能、尺寸穩定性、耐沖擊性和防潮性均高于紙基材。其電氣性能優良，工作溫度高，受環境影響小。在加工工藝上，它比其他樹脂的玻璃纖維布基板有很大的優勢。這類產品主要用于雙面PCB，數量較多。電氣絕緣性能穩定，平整度好，表面光滑，無凹坑，厚度公差標準，適用于FPC加強板、PCB鉆墊、玻璃纖維介子、電位器碳膜印制玻璃纖維板等具有高性能電子絕緣要求的產品，精密行星齒輪（硅片研磨）、精密試驗板、燃氣（電器）設備絕緣支撐隔板、絕緣墊板、變壓器絕緣板、電機絕緣、研磨齒輪、電子開關絕緣板等。
Performance: The mechanical properties, dimensional stability, impact resistance and moisture resistance of the epoxy fiberglass substrate are higher than those of the paper substrate. Its electrical performance is excellent, its operating temperature is high, and its performance is less affected by the environment. In terms of processing technology, it has great advantages over other resin fiberglass cloth substrates. These products are mainly used for double-sided PCBs and are used in large quantities. Stable electrical insulation performance, good flatness, smooth surface, no pits, thickness tolerance standards, suitable for high performance electronic insulation requirements, such as FPC reinforcement board, PCB drilling pad, glass fiber meson, potentiometer carbon Film printing fiberglass board, precision star gear (wafer grinding), precision test board, gas (electrical) equipment insulation struts, insulation pads, transformer insulation board, motor insulation parts, grinding gears, electronic switch insulation boards, etc.

FR-4環氧板壓板加工的表面處理


1.在對銅表面進行圖形化和蝕刻以形成電路后，應盡量減少處理和與PTFE表面的接觸。操作員應戴上干凈的手套，并在每塊板上涂一層薄膜，以便轉移到下一工序。
After the copper surface is patterned and etched to form a circuit, try to reduce the handling and contact of the PTFE surface. The operator should wear clean gloves and place a film on each board for transfer to the next procedure.2.蝕刻PTFE表面具有足夠的粗糙度，可用于粘接。如果要粘合蝕刻板或未覆蓋層壓板，建議處理PTFE表面以提供足夠的附著力。PTH制備中使用的化學成分也可用于表面處理。建議使用等離子體蝕刻或含有鈉的化學試劑。

2.蝕刻PTFE表面具有足夠的粗糙度，可用于粘合。如果對薄板進行蝕刻或未覆蓋層壓板，建議對PTFE表面進行處理，以提供足夠的附著。pth制備過程中使用的化學成分也可用于表面處理。建議使用等離子蝕刻或含鈉化學品。
The etched PTFE surface has sufficient roughness for bonding. Where the lamella is etched or where the laminate is not covered, it is recommended that the PTFE surface be treated to provide adequate attachment. The chemical components used in the pth preparation process can also be used for surface treatment. Plasma etching or sodium containing chemicals are recommended.

3.銅表面處理應確保最佳結合強度。棕色氧化銅電路處理將加強表面形狀，以便于使用tacbond粘合劑進行化學粘合。第一個過程需要清潔劑去除殘留物和處理油。接下來，進行細銅蝕刻以形成均勻的粗糙表面區域。棕色氧化物針狀晶體在層壓過程中，粘合層穩定。像任何化學過程一樣，每個步驟后都需要進行充分的清潔。殘留的鹽會抑制粘附。應監督最終沖洗，并保持pH值小于8.5。逐層干燥，確保表面不被手油污染。
Copper surface treatment should ensure optimum bond strength. The brown copper oxide circuit treatment will reinforce the surface shape for chemical bonding using TacBond adhesive. The first process requires a cleaner to remove residual and processing oil. A fine copper etch is then performed to form a uniform rough surface area. The brown oxide needle crystals stabilize the adhesive layer during lamination. As with any chemical process, adequate cleaning after each step is required. Salt residue will inhibit adhesion. The final rinse should be supervised and maintained at a pH of less than 8.5. Dry layer by layer and ensure that the surface is not contaminated by oil on your hands.

1.在250華氏度（100℃）下烘烤層壓板以去除水分。層壓板應儲存在嚴格控制的環境中，并在24小時內使用。
Bake the plate at 250oF (100 ° C) to remove moisture. The plies are stored in a tightly controlled environment and used within 24 hours.

2.工具板和第一塊電解板之間應使用壓力場，以便控制板中的壓力能夠均勻分布。電路板和待填充電路板中存在的高壓區域將被磁場吸收。該場還可以統一從外部到中心的溫度。因此，控制板和控制板之間的厚度是均勻的。
A pressure field should be used between the tool plate and the first plate to distribute the pressure in the control panel evenly. The high voltage regions present in the board and in the board to be filled will be absorbed by the field. The field also unifies the temperature from the outside to the center. Thereby forming a uniform thickness between the control board and the control board.

3.電路板必須由供應商提供的TAC-bond薄層組成。切割和堆放薄層時，應注意防止污染。根據電路設計和填充要求，需要1至3層粘合劑薄層。要填充的區域和介電要求用于計算0.0015”（38微米）薄板的需求量。建議在層壓板之間使用干凈的精制鋼或鋁鏡板。
The board must consist of a thin layer of TAC BOND supplied by the supplier. Be careful to prevent contamination when cutting thin layers and stacking. Depending on the circuit design and filling requirements, 1 to 3 bonded layers are required. The areas that need to be filled and the dielectric requirements are used to calculate the 0.0015" (38 micron) sheet. It is recommended to use clean steel or aluminum mirror plates between the laminates.

4.為輔助層壓，加熱前抽真空20分鐘。在整個循環中保持真空。抽氣將有助于確保電路封裝完成。
To assist in lamination, vacuum treatment is carried out for 20 minutes before heating. The vacuum is maintained throughout the cycle. Pumping away from the air will help ensure that the circuit is packaged.

5.在中心板的外圍區域放置熱電偶可以確定溫度監控和適當的循環。
Place a thermocouple in the peripheral area of the center plate to determine temperature monitoring and appropriate cycles.

6.板材可裝入冷的或預熱的壓盤中啟動。如果不使用壓力場進行補償，熱升和循環將不同。進入包裝的熱量輸入不重要，但應盡可能控制，以減少外圍和中心區域之間的間隙通常，加熱速率在12-20of/min（6-9℃/min）和425of（220℃）之間。
The plate can be loaded onto a cold or preheated press platen. If the pressure field is not used for compensation, the heat rise and cycle will be different. It is not critical to enter heat into the package, but it should be controlled to minimize the gap between the perimeter and the center. Typically, the heat rate is between 12-20oF/min (6-9 °C/min) and 425oF (220 °C).